Home appliance market review: domestic sales and exports, the "playing style" is very different

With the continuous development of SMT electronic components to miniaturization, the degree of chip integration is getting higher and higher, whether it is notebooks, smartphones or medical devices, automotive electronics, military and aerospace products, there are more and more BGA, CSP and other device applications in the array packaging in the products, and the quality requirements for products are also increasing. 5G is a hot word in 2019, and now the 5G era has begun, from the inside of the mobile phone PCBA circuit board, compared with 4G mobile phones, the design difficulties of 5G mobile phones are mainly concentrated in RF, antennas, etc. in addition to baseband chips. Because 5G is at least 1 times higher than 4G frequency, 5 times higher frequency bandwidth, up to 29 frequency bands, 5 times higher power, 10 times higher speed, and dozens of times more antennas.

This requires us to continuously improve our process capabilities, increase equipment, and ensure high-reliability products through high-quality welding. Various process analysis of PCBA highly reliable soldering In the high-precision electronic manufacturing process, there are many SMT production equipment, the main automation equipment is SMT automatic X-RAY counting machine, SMT first article detector, automatic solder paste printing machine, online 3D-SPI solder paste printing detector, placement machine, reflow soldering, online AOI optical detector, online PCBA automatic milling cutter splitting machine, etc. Each device has a specific function and use, and the reflow oven is the back-end process of the SMT production line, responsible for melting the solder of the already mounted PCB circuit board and components and bonding them to the motherboard.

Reflow soldering has become the mainstream process of SMT, most of the components on our commonly used smartphone boards are soldered to the circuit board through this process, which relies on the action of hot air flow on the solder joints, and the gelatinous flux is physically reacted under a certain high temperature air flow to achieve SMD soldering; The reason why it is called "reflow soldering" is because the gas circulates and flows in the welding machine to generate high temperature to achieve the purpose of welding. There are also many varieties of reflow soldering ovens, such as hot air reflow soldering, nitrogen reflow soldering, vapor phase reflow soldering, vacuum reflow soldering, etc.